迅达技术学术中心的随需资源
我们的全球工程专家团队为您呈献, 我们的资源涵盖了从入门到高阶的一系列主题。这些资源将增强您对新兴技术趋势的了解，并为您提供与印刷电路板和电子元件供应商更深层次接触而所需的知识，从而为您的应用带来更好的结果。
Webinar Recordings
Latest Webinar Recordings
Optimization and Recommendations on Implementing TTM Xinger? RF Passive Components in All Applications
This webinar explores TTM RF & Specialties Xinger? Components, in all aspects of their implementation into modern RF systems...
Latest Webinar Recordings
PCB 101 (in Mandarin)
Discover the world of PCB design, whether you are just starting out or refining your expertise
Other Webinar Recordings
ON-DEMAND RESOURCES
Cost Consideration
On-Demand Resources
Artificial Intelligence – Design and Manufacturing Opportunities and Challenges in the PCB Industry
ON-DEMAND RESOURCES
PCB Manufacturing from A-Z
On-Demand Resources
Impedance Control and Stack-ups Fundamentals
ON-DEMAND RESOURCES
Optimization and Recommendations on Implementing TTM RF&S Xinger RF Passive Components in all Applications
ON-DEMAND RESOURCES
PCB Design for Manufacturing: Cost Considerations (English)
ON-DEMAND RESOURCES
Rigid-Flex 101
Digest 期号
主题
链结
Mar-25
Transforming Transportation
Feb-25
The Critical Role of PCBs in Driving AI Technology Forward
Jan-25
Wishing you a successful 2025!
Dec-24
Happy Holidays from TTM!
Nov-24
Driving Innovation: 外网天堂' Role in the Future of Automotive Smart Antennas
Oct-24
Join Our Upcoming TTM Tech Academy Webinars!
Sep-24
Discover PCB Innovations with 外网天堂
夏季-2024
外网天堂 2024年第二季业绩发布，以及更多...
2024年4月
外网天堂 2024年第一季业绩发布，以及更多...
2024年3月
迅达槟城正式开业，以及更多...
订阅我们每月发送的公司新闻通讯“ TTM Digest”，助您了解最新的行业新闻、主题趋势和市场动态！
TTM TECHMINUTE
Richard Dang - Field Application Engineer
Ep 14 -?What's the limit on stacked micro-vias?
Richard Dang - Field Application Engineer
Ep 13 -?How do you verify the trace impedance?
Richard Dang - Field Application Engineer
Ep 12 - How can you work with the PCB manufacturer to reduce the soldermask thickness on PCBs?
Richard Dang - Field Application Engineer
Ep 11 - Is there any cost impact between via plug vs soldermask open?
Richard Dang - Field Application Engineer
Ep 10 - Regarding Via Tenting, what if the mask is "partially" over the via pad, leaving the hole open?
Richard Dang - Field Application Engineer
Ep 9 - Can you compare the cost of Edge Plating vs Edge Pinning Vias?
Mark Bowyer -Director, Business Development - RF&S
Ep 8 - How are the introduced data or components different from the available market solutions?
Gavin Hung - 汽车及医疗，工业与仪器仪表业务部FAE经理
-?To improve thermal dissipation, should I use Press-fit Coin or Embedded Coin to replace thermal vias? (English with Chinese subtitle)
Gavin Hung - Field Applications Engineering Manager - AMI&I BU
Ep 6 -?Can we directly replace laser vias with backdrills??(Mandarin with English subtitles)
Gavin Hung - 汽车及医疗，工业与仪器仪表业务部FAE经理
- 不同芯板层是怎样黏合起来的？
Tom Buck - 射频技术项目经理
-?您有哪些建议给予建立射频／毫米波或微波印刷电路板设计的人？
Andy Cameron -?现场应用工程经理
-?氧化物工艺如何影响插入损耗?
Randy Mattsen - 高级现场应用工程师
-?印刷电路板材料选择的关键注意事项
Nick Koop - 柔性技术总监
-?软板结构的最大铜密度规格
寻找有关特定主题的信息？
我们的专家在这裡為您提供来帮忙。请与我们联系，以为您提供现场或在线活动，或随需资源，来支持您的团队进行下一个带来变革的创新。
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